DocumentCode
2526546
Title
Development of new toughening modified dielectric epoxies
Author
Cao, You-ming ; Sun, Jun ; Yu, De-mei
Author_Institution
Xi´´an Jiaotong Univ., China
Volume
2
fYear
2000
fDate
2000
Firstpage
903
Abstract
In this paper, the epoxy is toughening modified by adding polyester (PET) and nano-Al2O3 particles, both dielectric and mechanical properties of the modified epoxies are examined. The influence of the frequency of electric field and temperature on dielectric loss, and the effect of the nano-particles addition on impact strength, tensile strength and modulus are investigated. The experimental results showed that: the impact toughness, tensile strength and modulus of the modified epodes are remarkable greater than those of pure epoxy resin. Dielectric losses of the modified epoxies are of the order of 10-4 in magnitude when temperature is less than 393 K. A peak phenomenon appears when the testing temperature is increased between 393-413 K. The dielectric loss is dramatically reduced and becomes a constant with increasing electric field frequency
Keywords
alumina; dielectric losses; elastic moduli; epoxy insulation; filled polymers; fracture toughness; impact strength; nanostructured materials; particle reinforced composites; polymer blends; tensile strength; 393 to 413 K; Al2O3; PE; dielectric loss; dielectric properties; electric field; electric field frequency; epoxy; impact strength; impact toughness; mechanical properties; modulus; nano-Al2O3 particles; nano-particles addition; polyester; tensile strength; testing temperature; toughening modified dielectric epoxies; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Epoxy resins; Mechanical factors; Mechanical variables measurement; Packaging; Positron emission tomography; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2000. Proceedings of the 6th International Conference on
Conference_Location
Xi´an
Print_ISBN
0-7803-5459-1
Type
conf
DOI
10.1109/ICPADM.2000.876375
Filename
876375
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