DocumentCode :
2526589
Title :
Low threshold voltage CMOS devices with smooth topography for 1 volt applications
Author :
Yu, D.C.H. ; Lin, H.D. ; McAndrew, C. ; Lee, K.H.
Author_Institution :
AT&T Bell Labs., Orlando, FL, USA
fYear :
1994
fDate :
11-14 Dec. 1994
Firstpage :
489
Lastpage :
492
Abstract :
CMOS devices with ultra-low threshold voltage, high performance, and smooth topography are fabricated for 1 volt applications. Novel features of the devices include (1) enhanced self-aligned twin-tub with low surface dopant level, deep concentration profile, and low n-p tub boundary height, (2) dual-gate implant with wafer tilted to achieve thin gate height while suppressing ion penetration, and (3) use of hard-mask and sidewall dielectrics to protect the TiN dual-gate shunt layer against oxidation. Excellent device characteristics has been demonstrated in this work.<>
Keywords :
CMOS integrated circuits; MOSFET; doping profiles; integrated circuit technology; ion implantation; surface topography; 1 V; 1 volt applications; TiN; deep concentration profile; dual-gate implant; dual-gate shunt layer; hard-mask; high performance devices; low threshold voltage CMOS devices; self-aligned twin-tub; sidewall dielectrics; smooth topography; tilted wafer; ultralow threshold voltage; Annealing; Boron; Costs; Doping; Implants; Low voltage; Surface topography; Temperature; Thermal resistance; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-2111-1
Type :
conf
DOI :
10.1109/IEDM.1994.383362
Filename :
383362
Link To Document :
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