Title :
Measurement of power distribution network impedance using an error analysis approach
Author :
Eng-Kee Chua ; Xing-Ming Li ; Shan-Qing Hu ; Kye-Yak See
Author_Institution :
Nanyang Technol. Univ., Singapore, Singapore
Abstract :
In order to achieve power integrity (PI), power distribution network (PDN) impedance has been designed lower than calculated target impedance in frequency domain. However, with PDN impedance scaling down milliohm order, its measurement accuracy has been limited by the inevitable uncertainty from vector network analyzer (VNA). In this paper, we investigate the uncertainty effects in three impedance measurement methods using an error analysis approach. Impedance error rate is proposed as a function of variable uncertainty and the impedance of device under test (DUT), to represent the measurement accuracy. By analysis, we find that three methods have different accuracy for different DUT impedance ranges, and the appropriate method should be employed for different DUT measurements. Taking a fabricated power ground plane board (a special PDN) as case study, the measured results from three methods are compared with the simulated results from cavity model method and EM simulations in Computer Simulation Technology (CST) Microwave Studio, and the comparison results correlate well with our error analysis results. It´s proven that the two-port method based on scattering parameter (S parameter) S21 performs best with highest accuracy for measuring the PDN impedance scaling down to milliohm order.
Keywords :
S-parameters; distribution networks; electric impedance; error analysis; frequency-domain analysis; network analysers; power engineering computing; power system measurement; CST microwave studio; DUT impedance; EM simulations; PDN impedance measurement; PI; S-parameter; VNA; cavity model method; computer simulation technology microwave studio; device under test impedance; error analysis approach; frequency domain; impedance error rate; power distribution network impedance measurement; power ground plane board fabrication; power integrity; scattering parameter; two-port method; variable uncertainty function; vector network analyzer; Accuracy; Error analysis; Impedance; Impedance measurement; Measurement uncertainty; Scattering parameters; Uncertainty;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028273