Title :
Through silicon via (TSV) scallop smoothening technique
Author :
Goon Heng Wong ; King Jien Chui ; Guan Kian Lau ; Woon Leng Loh ; Li HongYu
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
To achieve high performance in a small form factor and to overcome Moore Law´s by still achieving more transistors on microchips are through 2.5D and 3D chips stacking [1]. Through Si via (TSV) is the key to 2.5 D and 3D technology and is gaining more and more interest from many giant chipmakers [2]. Various defects may form during silicon etch in TSV due to the etching mechanism [3].
Keywords :
etching; three-dimensional integrated circuits; 3D chip stacking; 3D technology; Moore law; Si; TSV scallop smoothening technique; etching mechanism; microchip; through silicon via technology; Cleaning; Dielectrics; Etching; Microelectronics; Silicon; Three-dimensional displays; Through-silicon vias;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028274
