Title :
Effect of reaction-induced phase separation on dielectric properties of epoxy resin modified with rubber
Author :
Desheng, Wang ; Guanghua, Zhang ; Yajie, Zhang ; Shoutian, Chen
Author_Institution :
State Key Lab. of Electr. Insulation for Power Equipment, Xi´´an Jiaotong Univ., China
Abstract :
The phase separation and polymerization took place during the curing process of the epoxy resin system, which consisted of diglycidyl ether of bisphenol A and a novel liquid rubber QR. The phase structure development was investigated by scanning electron microscopy (SEM). SEM revealed that the spherical rubber domain was dispersed randomly in the cured epoxy resin matrix. The domain size changed with the content of the modified rubber QR in the system. The higher the QR content, the larger was the spherical domain. Therefore, dielectric loss (tanδ), dielectric constant (εr) and volume resistivity (ρv) of the cured resin were changed by different polarizations, especially interface polarization, which is introduced by the second rubber phase
Keywords :
composite insulating materials; dielectric losses; dielectric polarisation; electrical resistivity; permittivity; phase separation; polymer blends; polymer structure; polymerisation; rubber; scanning electron microscopy; SEM; bisphenol A diglycidyl ether; curing process; dielectric constant; dielectric loss; dielectric properties; epoxy resin system; interface polarization; liquid rubber QR; phase structure development; polymerization; random dispersion; reaction-induced phase separation; rubber modified epoxy resin; scanning electron microscopy; second rubber phase; spherical domain; spherical rubber domain; volume resistivity; Composite materials; Curing; Dielectric liquids; Dielectric losses; Dielectric materials; Epoxy resins; Polarization; Production facilities; Rubber; Scanning electron microscopy;
Conference_Titel :
Properties and Applications of Dielectric Materials, 2000. Proceedings of the 6th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
0-7803-5459-1
DOI :
10.1109/ICPADM.2000.876382
