Title :
P4 probe card-a solution for at-speed, high density, wafer probing
Author :
Pandey, Rajiv ; Higgins, Dan
Author_Institution :
Cerprobe Corp., Gilbert, AZ, USA
Abstract :
We introduce a promising new probe card technology the P4 (Photolithographic Pattern Plated Process) probe card-which offers a solution for at-speed wafer probe at high pin count applications. We describe the P4 probe card, highlight some of its features such as its unique construction, which allows it to perform with the robustness of an epoxy-ring probe card on aluminum pads, yet enables high frequency probing up to 9 GHz bandwidth. We present data on the electrical and mechanical characteristics of the P4 probe card such as bandwidth, crosstalk, contact resistance and probe tip force/deflection performance
Keywords :
automatic testing; contact resistance; crosstalk; integrated circuit testing; probes; 9 GHz; P4 probe card; at-speed wafer probing; contact resistance; crosstalk; epoxy-ring probe card; force/deflection performance; high frequency probing; high pin count applications; mechanical characteristics; photolithographic pattern plated process; probe tip; Aluminum; Bandwidth; Biomembranes; Circuit testing; Frequency; Integrated circuit packaging; Integrated circuit testing; Manufacturing; Needles; Probes;
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5093-6
DOI :
10.1109/TEST.1998.743271