Title :
Picking large thinned dies with high topography on both sides
Author :
Gerets, C. ; Derakhshandeh, J. ; Teng Wang ; Capuz, G. ; Podpod, A. ; Demeurisse, C. ; Rebibis, K.J. ; Miller, A. ; Beyer, G. ; Beyne, E.
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
The process of picking large thinned dies, as a crucial step of the pre-assembly part in a 3D integration flow, has been investigated in this paper. Key factors affecting the yield of this process are identified to be the selection of correct collet material, the needle configuration, and ejection height. By combining correct tools and optimized process parameters, large 50 μm thick dies with dimensions up to 31.6×26 mm2 can be successfully picked. Cu and Sn micro-bumps on both sides of the thin dies are well preserved after the picking process.
Keywords :
copper; microassembling; three-dimensional integrated circuits; tin; wafer bonding; 3D integration flow; Cu; Sn; copper microbumps; ejection height; large thinned die picking process; needle configuration; tin microbumps; Conferences; Electronics packaging; Needles; Nickel; Surfaces; Three-dimensional displays; Tin;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028289
