Effect of additive elements on crack propagation behavior for Sn-Bi solders at high temperatures

Author

Hiyoshi, N. ; Yamashita, M. ; Hokazono, H.

Author_Institution

Dept. of Mech. Eng., Ishikawa Nat. Coll. of Technol. Kitachujyo, Tsubata, Japan

fYear

2014

fDate

3-5 Dec. 2014

Firstpage

57

Lastpage

60

Abstract

This paper discusses the effect of additive elements on crack propagation behavior for Sn-Bi solders at high temperatures. Sn-Bi solders are lower melting point materials, so that it is useful for low temperature soldering. Crack initiation and propagation behavior of three kinds of Sn-Bi solders were observed in this study. There were effects of additive elements Ag, Cu, Ni and Ge on crack propagation rate although there was no effect on crack initiation. The crack propagation of Sn57.5Bi0.5AgCuNiGe solder seems to have a slower rate than Sn58Bi and Sn57.5Bi0.5Ag solders. The J-integral range parameter evaluates the crack propagation rate independent of the additive elements at high temperatures.

Keywords

bismuth compounds; copper compounds; silver compounds; solders; tin compounds; J-integral range parameter; Sn-Bi; SnBiAgCuNiGe; additive elements; crack initiation; crack propagation behavior; low temperature soldering; melting point materials; Additives; Fatigue; Loading; Nickel; Strain; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th

Conference_Location

Singapore

Type

conf

DOI

10.1109/EPTC.2014.7028297

Filename

7028297