Title :
Aging effect on creep properties of SnBi solders
Author :
Sakane, M. ; Yagi, K. ; Itoh, T. ; Yamashita, M. ; Hokazono, H.
Author_Institution :
Dept. of Mech. Eng., Ritsumeikan Univ., Kusatsu, Japan
Abstract :
This paper discusses the effects of additive elements and aging on creep properties of SnBi solder system. Creep tests were performed on unaged and aged SnBi, SnBiAg and SnBiAgCuNiGe solders at three temperatures and the effects of them on creep rupture lifetimes and creep strain rates were discussed. The additive elements decreased creep strain rates and elongated creep rupture lifetimes. Causes of the effects were discussed from EBSD observations. The additive elements reduced the grain size and the aging coarsened grain size. The grain size had a pronounced effect on the creep strain rates and rupture lifetimes.
Keywords :
ageing; alloying additions; bismuth alloys; copper alloys; creep; creep testing; germanium alloys; grain size; nickel alloys; silver alloys; solders; tin alloys; EBSD observation; SnBi; SnBiAg; SnBiAgCuNiGe; additive element; aging coarsened grain size; aging effect; creep property; creep strain rate; creep test; elongated creep rupture lifetime; solder system; Aging; Bismuth; Creep; Grain size; Strain; Testing; Tin;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028312
