DocumentCode
252736
Title
Microfabricated SOI pressure sensor using dynamically balanced lateral resonator
Author
Sen Ren ; Weizheng Yuan ; Xiaodong Sun ; Jinjun Deng ; Dayong Qiao ; Chengyu Jiang
Author_Institution
Key Lab. of Micro/Nano Syst. for Aerosp., Northwestern Polytech. Univ., Xi´an, China
fYear
2014
fDate
13-16 April 2014
Firstpage
229
Lastpage
232
Abstract
A resonant pressure sensor using a dynamically balanced lateral resonator is presented, which employs differential electrostatic comb structure for linear driving and sensing. The sensor is successfully microfabricated through a simple yet reliable micromachining process based on a commercially available silicon-on-insulator wafer with only two masks. Special anchor structure is developed to suppress the vertical position shift of the resonator when the diaphragm deflects, which using suspended connecting trusses to attach the stress-sensitive beam ends of the resonator. The sensor chip is mounted into a custom 16-pin Kovar package with epoxy resin for preliminary measurements. Testing results show that the resonator has a fundamental resonant frequency of 34.17 kHz, and the quality factor is about 1253 at atmospheric pressure, which rises to above 50 000 below 5 Pa. Over the pressure range of 100-380 kPa, the static pressure sensitivity is approximately 10.17 Hz/kPa, with the nonlinearity of 0.02%FS, the hysteresis error of 0.05%FS, and the repeatability error of 0.17%FS.
Keywords
Q-factor; atmospheric pressure; electronics packaging; micromachining; micromechanical resonators; microsensors; pressure sensors; resins; silicon-on-insulator; Kovar package; anchor structure; atmospheric pressure; balanced lateral resonator; differential electrostatic comb structure; epoxy resin; frequency 34.17 kHz; hysteresis error; linear driving; microfabricated SOI pressure sensor; micromachining process; pressure 100 kPa to 380 kPa; quality factor; repeatability error; resonant frequency; resonant pressure sensor; sensor chip; silicon-on-insulator wafer; static pressure sensitivity; stress-sensitive beam ends; SOI; micromachining; pressure sensor; resonator;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2014 9th IEEE International Conference on
Conference_Location
Waikiki Beach, HI
Type
conf
DOI
10.1109/NEMS.2014.6908797
Filename
6908797
Link To Document