Mechanical properties of low-silver Sn-1.0Ag-0.7Cu-1.6Bi-0.2In solder

Author

Takahashi, Y. ; Shohji, I.

Author_Institution

Fac. of Sci. & Technol., Gunma Univ., Kiryu, Japan

fYear

2014

fDate

3-5 Dec. 2014

Firstpage

784

Lastpage

787

Abstract

Tensile and fatigue properties of low-Ag lead-free Sn-1.0Ag-0.7Cu-1.6Bi-0.2In (mass%) solder were investigated with miniature size specimens. The obtained data were compared with those of Sn-3.0Ag-0.5Cu (mass%). Tensile strength and 0.1% proof stress of Sn-1.0Ag-0.7Cu-1.6Bi-0.2In are higher than those of Sn-3.0Ag-0.5Cu regardless of strain rate and temperature investigated. Although elongation of Sn-1.0Ag-0.7Cu-1.6Bi-0.2In is inferior to that of Sn-3.0Ag-0.5Cu at 25°C and 80°C, this trend is reversed at 120°C. Fatigue properties of Sn-1.0Ag-0.7Cu-1.6Bi-0.2In scarcely changes at 25°C and 125°C. Although fatigue life of Sn-1.0Ag-0.7Cu-1.6Bi-0.2In is inferior to that of Sn-3.0Ag-0.5Cu at 25°C, fatigue lives of both solder are at the same level at 125°C.

Keywords

bismuth alloys; copper alloys; elongation; fatigue; indium alloys; silver alloys; solders; tensile strength; tin alloys; SnAgCuBiIn; elongation; fatigue life; low-silver lead-free solder; temperature 120 degC; temperature 25 degC; temperature 80 degC; tensile strength; Fatigue; Lead; Materials; Strain; Stress; Surface cracks; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th

Conference_Location

Singapore

Type

conf

DOI

10.1109/EPTC.2014.7028317

Filename

7028317