DocumentCode
252763
Title
Design and fabrication of micro hot-wire flow sensor using 0.35μm CMOS MEMS technology
Author
Zhuonan Miao ; Chao, Christopher Y. H. ; Yi Chiu ; Chia-Wei Lin ; Yi-Kuen Lee
Author_Institution
Dept. of Mech. & Aerosp. Eng., HKUST, Kowloon, China
fYear
2014
fDate
13-16 April 2014
Firstpage
289
Lastpage
293
Abstract
MEMS sensors are promising for Energy Efficient Building (EeB) because of the potential low cost and low power consumption. Various flow sensors based on MEMS technology have been fabricated. In this work, we designed and fabricated a polysilicon micro hot-wire flow sensor using a commercial 0.35μm 2P4M CMOS technology followed by post-CMOS processing. A post-CMOS MEMS process for a 1.5mm×1.5mm sensor chip using Deep Reactive Ion Etch (DRIE) and spray coating was utilized to finish the fabrication. The fabricated flow sensor was characterized at different flow rates. The fabricated sensor with a dimension of 300μm×2μm×3.76μm demonstrated a sensitivity of 23.87 mV/(m/s) and power consumption of 0.79 mW at Uin =5m/s. The experiment results were consistent with the theoretical prediction and the best results showed an average error of only 5%.
Keywords
CMOS integrated circuits; elemental semiconductors; flow sensors; microsensors; silicon; spray coatings; sputter etching; 2P4M CMOS technology; CMOS MEMS technology; DRIE; MEMS sensors; Si; deep reactive ion etch; polysilicon microhot-wire flow sensor; post-CMOS MEMS process; power 0.79 mW; sensor chip; size 0.35 mum; spray coating; CMOS integrated circuits; CMOS technology; Fabrication; Fluid flow measurement; Micromechanical devices; Sensitivity; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2014 9th IEEE International Conference on
Conference_Location
Waikiki Beach, HI
Type
conf
DOI
10.1109/NEMS.2014.6908810
Filename
6908810
Link To Document