Title : 
Progress in Use of Ultra-High Vacuum Cathodic Arcs for Deposition of Thin Film Superconducting Layers
         
        
            Author : 
Langner, J. ; Sadowski, M.J. ; Strzyzewski, P. ; Mirowski, R. ; Witkowski, J. ; Tazzari, S. ; Catani, L. ; Cianchi, A. ; Lorkiewicz, J. ; Russo, R. ; Paryjczak, T. ; Rogowski, J. ; Sekutowicz, J.
         
        
            Author_Institution : 
Andrzej Soltan Inst. for Nucl. Studies, Otwock-Swierk
         
        
        
        
        
        
        
            Abstract : 
The paper reports on recent progress in the application of the UHV arc technology, which was proposed as an alternative solution for the deposition of thin superconducting films of pure niobium (Nb) upon the inner surfaces of RF cavities designed for particle accelerators. There are presented new experimental studies aimed at the deposition of superconducting films of pure niobium (Nb) and lead (Pb) needed for the modern accelerator technology. The main experimental results and characteristics of arc-deposited thin superconducting films are discussed, and the progress achieved recently in the formation of such films is presented
         
        
            Keywords : 
lead; niobium; particle accelerators; superconducting thin films; vacuum arcs; vacuum deposition; Nb; Pb; RF cavities; UHV arc technology; particle accelerators; pure niobium; superconducting layers; thin film deposition; thin superconducting films; ultra-high vacuum cathodic arcs; Lead; Linear particle accelerator; Niobium; Paper technology; Radio frequency; Sputtering; Superconducting epitaxial layers; Superconducting films; Superconducting thin films; Vacuum arcs;
         
        
        
        
            Conference_Titel : 
Discharges and Electrical Insulation in Vacuum, 2006. ISDEIV '06. International Symposium on
         
        
            Conference_Location : 
Matsue
         
        
        
            Print_ISBN : 
1-4244-0191-7
         
        
            Electronic_ISBN : 
1093-2941
         
        
        
            DOI : 
10.1109/DEIV.2006.357356