DocumentCode
2527784
Title
Capacitive impedance readout tactile image sensor
Author
Boie, R.A.
Author_Institution
Bell Laboratories, Murray Hill, New Jersey
Volume
1
fYear
1984
fDate
30742
Firstpage
370
Lastpage
378
Abstract
The transduction of mechanical forces to representative electrical signals uses a three layer sandwich structure. The top layer is columns of compliant metal strips over a central elastic dielectric sheet. The bottom layer is a flexible printed circuit board with rows of metal strips and multiplexing circuits. Electrically, the sensor is a capacitor array formed by the row and column crossings with the middle layer functioning as a dielectric spring. A readout of the capacitor values corresponds to a sampled tactile image. The reasons for choosing this transduction method, the performance advantages of capacitive sensing and the design and integration of 64 element imagers into the fingers of a controlled compliance gripper are described.
Keywords
Capacitive sensors; Capacitors; Dielectrics; Flexible printed circuits; Image sensors; Impedance; Mechanical sensors; Sandwich structures; Sensor arrays; Springs;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation. Proceedings. 1984 IEEE International Conference on
Type
conf
DOI
10.1109/ROBOT.1984.1087186
Filename
1087186
Link To Document