Field-assisted titanium-glass bonding

Author

Tianyu Li ; Yiming Zhang ; Jin Luo ; Jing Chen

Author_Institution

Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China

fYear

2014

fDate

13-16 April 2014

Firstpage

362

Lastpage

365

Abstract

This paper reports the evaluation and characterization of titanium-glass field-assisted bonding which is suitable for microsystem packaging, especially biocompatible ones. The influence of surface roughness, bonding voltage and temperature on bonding quality was investigated. Using a point contact anode, 1 inch titanium substrates of 200 μm-thick were successfully bonded to the soda lime glass at 400 °C applying a voltage of 400V. With good repeatability, over 70% of the surface was joined, and the bonding strength and the the fracture strength of glass pertained to the same order of magnitude.

Keywords

bonding processes; electronics packaging; glass; point contacts; surface roughness; titanium; bonding quality; bonding voltage; field assisted titanium glass bonding; microsystem packaging; point contact anode; size 1 inch; size 200 mum; surface roughness; temperature 400 degC; voltage 400 V; Bonding; Glass; Rough surfaces; Stress; Substrates; Surface roughness; Titanium; Field-assisted bonding; glass; titanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2014 9th IEEE International Conference on

Conference_Location

Waikiki Beach, HI

Type

conf

DOI

10.1109/NEMS.2014.6908827

Filename

6908827