DocumentCode :
252793
Title :
Analysis of silicone-based adhesive bond separation
Author :
Khoong, L.E. ; Gan, T.K. ; Young, M.B.
Author_Institution :
Delphi Automotive Syst. Singapore Pte. Ltd., Singapore, Singapore
fYear :
2014
fDate :
3-5 Dec. 2014
Firstpage :
159
Lastpage :
163
Abstract :
Silicone-based adhesive bond separations on polymer and ceramic-based samples were analyzed. Scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), Fourier transform infra-red spectroscopy (FTIR) and Gas chromatography mass spectrometry (GCMS) analyses were conducted on surfaces of glass fiber reinforced polybutylene terephthalate (PBT) and aluminum nitride samples. Further surface analyses, i.e. surface contact angle measurement, X-ray photoelectron spectroscopy (XPS) and time of flight secondary ion mass spectrometry (TOF-SIMS) indicates that the adhesive bond separation could have been caused by excessive sulfur content on the PBT surface and excessive residual organic compound containing hydroxyl functional group on aluminum nitride surface. Potential separation mechanisms of the adhesive bond for these two case studies were also discussed.
Keywords :
Fourier transform infrared spectroscopy; X-ray chemical analysis; X-ray photoelectron spectra; adhesive bonding; aluminium compounds; chromatography; glass fibre reinforced composites; scanning electron microscopy; silicones; time of flight mass spectroscopy; AlN; EDX; FTIR; Fourier transform infrared spectroscopy; GCMS analyses; PBT surface; SEM; TOF-SIMS; X-ray photoelectron spectroscopy; XPS; ceramic-based samples; energy dispersive X-ray spectroscopy; excessive residual organic compound; gas chromatography mass spectrometry; glass fiber reinforced polybutylene terephthalate; hydroxyl functional group; polymer-based samples; scanning electron microscopy; silicone-based adhesive bond separation; surface analyses; surface contact angle measurement; time of flight secondary ion mass spectrometry; Adhesives; Ceramics; Coatings; Compounds; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
Type :
conf
DOI :
10.1109/EPTC.2014.7028346
Filename :
7028346
Link To Document :
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