Effect of copper roughness on dielectric adhesion

The effect of processing the photo-sensitive insulating material on different copper surface roughness could illustrate the effect on the adhesion of these materials with a variation in surface roughness. A correlation study was conducted with copper roughness with application of both high-temperature & low-temperature curing dielectric to gain a better understanding of the resultant adhesion strength to the change in surface roughness. The morphology of the copper surface and adhesion of the polymer demonstrated the effect of chemical bonding and mechanical interlocking.