• DocumentCode
    2528259
  • Title

    Charging identification and compensation in the scanning electron microscope

  • Author

    Wong, W.K. ; Thong, J.T.L. ; Phang, J.C.H.

  • Author_Institution
    Fac. of Eng., Nat. Univ. of Singapore, Singapore
  • fYear
    1997
  • fDate
    21-25 Jul 1997
  • Firstpage
    97
  • Lastpage
    102
  • Abstract
    Common charging artifacts in the scanning electron microscope (SEM) are discussed. A novel method employing front-end control of the SEM beam voltage and scanning to achieve charging compensation was also discussed. Results show that the new technique is effective in reducing highly-negative charging as well as providing a means for the experimental measurement of charging using the electrostatic mirror
  • Keywords
    compensation; failure analysis; integrated circuit testing; photoresists; scanning electron microscopy; IC testing; beam voltage; charging artifacts; charging identification; compensation; electrostatic mirror; failure analysis; front-end control; highly-negative charging; scanning electron microscope; Electron beams; Electrostatics; Failure analysis; Insulation; Mirrors; Optical imaging; Optical microscopy; Resists; Scanning electron microscopy; Vision defects;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
  • Print_ISBN
    0-7803-3985-1
  • Type

    conf

  • DOI
    10.1109/IPFA.1997.638151
  • Filename
    638151