A temperature compensation system for silicon pressure sensor based on neural networks

Author

Guanwu Zhou ; Yulong Zhao ; Fangfang Guo

Author_Institution

State Key Lab. for Mech. Manuf. Syst., Xi´an Jiaotong Univ., Xi´an, China

fYear

2014

fDate

13-16 April 2014

Firstpage

467

Lastpage

470

Abstract

We present a temperature compensation system for silicon piezoresistive pressure sensor based on neural network. This system can be used for measuring the pressure of various media. And the design can simplify the implementing hardware of pressure measurement system. Compared with traditional design, it can output three signals: current signal, digital signal based on RS485 and Zigbee wireless signal, which make the system more practical to use. Due to temperature drift of silicon piezoresistive sensors, a program developed on LabVIEW in PC is used for temperature compensation using neural networks. The efficacy of neural networks has been verified by linearity, zero temperature drift and sensitivity temperature drift of pressure sensor after temperature compensation. After being tested over temperature range and pressure range, the accuracy of pressure measurement system from 0.7%FS (full scale) has been promoted up to 0.2%FS.

Keywords

Zigbee; compensation; elemental semiconductors; neural nets; piezoresistive devices; pressure measurement; pressure sensors; signal conditioning circuits; silicon; temperature measurement; temperature sensors; virtual instrumentation; LabVIEW; RS485; Si; Zigbee wireless signal; current signal; digital signal; neural network; piezoresistive pressure sensor; pressure measurement system; sensitivity temperature drift; temperature compensation system; zero temperature drift; Accuracy; Neural networks; Piezoresistance; Pressure measurement; Silicon; Temperature measurement; Temperature sensors; atificial neural network; back propagation; radial basis function; silicon pressure sensor; temperature compensation;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2014 9th IEEE International Conference on

Conference_Location

Waikiki Beach, HI

Type

conf

DOI

10.1109/NEMS.2014.6908851

Filename

6908851