Title :
A convenient wafer level bonding based on unpatterned BCB
Author :
Lei Li ; Kangfa Deng ; Wen Xia ; Ningli Zhu ; Song Li ; Weiguo Su ; Wei Zhang
Author_Institution :
Nat. Key Lab. of Micro/Nano Fabrication Technol., Peking Univ., Beijing, China
Abstract :
In this paper, a convenient wafer level bonding based on un-patterned BCB to achieve all-silicon structures was presented. This method is easy to operate, and can be applied in the multi-wafer bonding. After the BCB was spin-coated on the substrate wafer and soft-baked, no process had been carried out on it. Both the time node of pressure applied to the bonding and the BCB soft-bake process had been explored before bonding two wafers. After bonding, the obtained results indicated that the BCB transverse deformation of this BCB bonding was less than 36μm at the optimal soft-bake temperature of 170 C with the soft-bake time of 40min. Also, the bonding strength of the BCB bonding was tested by DAGE 4000, and the results were 15~17MPa, which is suitable for the needs of the wafer level bonding.
Keywords :
elemental semiconductors; silicon; spin coating; wafer level packaging; BCB; DAGE 4000; Si; benzo-cyclo-butene; multiwafer bonding; pressure 15 MPa to 17 MPa; silicon structures; spin coating; temperature 170 C; time 40 min; wafer level bonding; Bonding; Glass; Silicon; Substrates; Surface treatment; BCB; soft bake; transverse deformation; wafer level bonding;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2014 9th IEEE International Conference on
Conference_Location :
Waikiki Beach, HI
DOI :
10.1109/NEMS.2014.6908859
