Title :
Study on compatible CMOS-MEMS process with surface micromachining for the application of monolithic integration
Author :
Danqi Zhao ; Xian Huang ; Jun He ; Li Zhang ; Peng Liu ; Fang Yang ; Dacheng Zhang
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China
Abstract :
In this work, compatible CMOS-MEMS process with surface micromachining is investigated. Surface micromachining method for cantilever fabrication has been merged with conventional CMOS process, and release of MEMS structure is conducted after CMOS process. We designed polysilicon MEMS structures as well as CMOS devices and circuits on a monolithic sensor chip for the investigation of the influence of stress induced by non-adequate post-CMOS annealing. The impact of step coverage and the releasing process on both the MEMS and CMOS components are also discussed.
Keywords :
CMOS integrated circuits; micromachining; monolithic integrated circuits; CMOS MEMS process; CMOS devices; cantilever fabrication; monolithic integration; monolithic sensor chip; step coverage; surface micromachining; CMOS integrated circuits; CMOS process; Fabrication; Micromachining; Micromechanical devices; Stress; Surface treatment; MEMS; monolithic integration; post-CMOS;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2014 9th IEEE International Conference on
Conference_Location :
Waikiki Beach, HI
DOI :
10.1109/NEMS.2014.6908861
