Basic evaluation of Au micro-bumps formed by cyanide-free electroless Au plating process

Author

Watanabe, N. ; Nemoto, S. ; Kikuchi, K. ; Aoyagi, M. ; Tokuhisa, T. ; Owada, T. ; Kato, M.

Author_Institution

Nanoelectron. Res. Inst., Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan

fYear

2014

fDate

3-5 Dec. 2014

Firstpage

525

Lastpage

530

Abstract

We conducted a basic evaluation of Au micro-bumps formed by cyanide-free electroless Au plating. The Au micro-bump diameter was approximately 10 μm. Bump height measurement, bump shear testing, and X-ray photoelectron spectroscopy of the Au surface were performed after Au micro-bump formation. Scanning ion microscope observation of the bonding interface, chip shear testing, four-terminal measurement, and daisy chain measurement were performed after flip-chip bonding. The results show that the Au micro-bumps have good mechanical and electrical properties.

Keywords

X-ray photoelectron spectra; electrical resistivity; electroless deposition; gold; height measurement; integrated circuit bonding; integrated circuit packaging; integrated circuit testing; ion microscopy; mechanical testing; Au; X-ray photoelectron spectroscopy; bonding interface; bump height measurement; bump shear testing; chip shear testing; cyanide-free electroless gold plating; daisy chain measurement; electrical properties; flip-chip bonding; four-terminal measurement; gold microbumps; gold surface; mechanical properties; scanning ion microscope observation; Annealing; Bonding; Cleaning; Gold; Pollution measurement; Semiconductor device measurement; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th

Conference_Location

Singapore

Type

conf

DOI

10.1109/EPTC.2014.7028391

Filename

7028391