DocumentCode :
2529043
Title :
Zero temperature coefficient gas-sealed pressure sensor using mechanical temperature compensation
Author :
Hao, X.C. ; Jiang, Y.G. ; Takao, H. ; Maenaka, K. ; Fujita, T. ; Higuchi, K.
Author_Institution :
Maenaka Human-Sensing Fusion Project, JST, Himeji, Japan
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
116
Lastpage :
119
Abstract :
A novel gas sealed capacitive pressure sensor with a self-temperature compensated structure is reported. The pressure sensor is sealed by Au-Au diffusion bonding in nitrogen with a pressure of 100 kPa and integrated with a platinum resistor based temperature sensor for human activity monitoring. A ring-shaped structure on the diaphragm of the pressure sensor is used for temperature compensation. The pressure sensor with the temperature compensation structure can mechanically suppress the thermal expansion effect of the sealed gas in cavity. Using the compensation structure, measured temperature coefficient was much reduced as compared to that of the pressure sensor without compensation. The sensitivities of the pressure sensor before and after compensation are almost same in a pressure range from 80 kPa to 100 kPa.
Keywords :
capacitive sensors; compensation; diaphragms; diffusion bonding; gold; monitoring; platinum; pressure sensors; resistors; temperature sensors; Au; Pt; diaphragm ring-shaped structure; diffusion bonding; human activity monitoring; mechanical temperature compensation; pressure 80 kPa to 100 kPa; resistor based temperature sensor; thermal expansion effect; zero temperature coefficient gas-sealed capacitive pressure sensor; Bonding; Capacitance; Cavity resonators; Sensitivity; Temperature measurement; Temperature sensors; Thermal expansion; Pressure sensor; gas-sealed; mechanical temperature compensation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969152
Filename :
5969152
Link To Document :
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