DocumentCode
2529069
Title
EYESEE: A machine vision system for inspection of integrated circuit chips
Author
Baird, Michael L.
Author_Institution
Contrex Inc., Suite, Santa Clara, CA
Volume
2
fYear
1985
fDate
31107
Firstpage
444
Lastpage
448
Abstract
A mechine vision system for inspecting either "in-process" or completed (fully patterned) integrated circuit (IC) chips has been demonstrated. Applied to the inspection of a Darlington IC, the EYESEE system was shown to effectively replace a human operator in performing a final inspection task. EYESEE has been extended to inspection of certain Large Scale Integration (LSI) and Very Large Scale Integration (VLSI) devices for characterization measurement of line widths and critical dimensions, for measurement of mask and reticle overlay registration accuracy, and for detection and identification of macro end micro defects. Technical feasibility has been established for automating many semiconductor inspection tasks. A comprehensive review of other relevant machine vision techniques used within the semiconductor manufacturing industry is presented.
Keywords
Fabrication; Humans; Ice; Inspection; Instruments; Laboratories; Large scale integration; Machine vision; Microscopy; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation. Proceedings. 1985 IEEE International Conference on
Type
conf
DOI
10.1109/ROBOT.1985.1087249
Filename
1087249
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