Title :
Design and implementation of a novel CMOS MEMS condenser microphone with corrugated diaphragm
Author :
Huang, Chien-Hsin ; Tsai, Ming-Han ; Lee, Chien-Hsing ; Hsieh, Tsung-Min ; Liou, Jhyy-Cheng ; Chen, Li-Che ; Yip, Ming-Chuen ; Fang, Weileun
Abstract :
This study reports a CMOS-MEMS condenser microphone implemented using the standard thin films stacking of 0.35μm UMC CMOS 3.3/5.0V logic process, and followed by post-CMOS micromachining steps without introducing any special materials. The corrugated diaphragm for microphone is designed and implemented using the metal layer to reduce the influence of thin film residual stresses. Moreover, silicon substrate is employed to increase the stiffness of back-plate. Measurements show the sensitivity of microphone is -42±3dBV/Pa at 1kHz under 6V pumping voltage, the frequency response is 100Hz-10kHz, and the S/N ratio >;55dB. Table1 summarizes detail specifications.
Keywords :
CMOS logic circuits; diaphragms; frequency response; internal stresses; micromachining; micromechanical devices; microphones; thin film devices; CMOS MEMS condenser microphone; Si; UMC CMOS logic process; corrugated diaphragm; frequency 100 Hz to 10 kHz; metal layer; post-CMOS micromachining step; size 0.35 mum; thin film residual stress; voltage 6 V; CMOS integrated circuits; CMOS process; Micromechanical devices; Microphones; Semiconductor device measurement; Sensitivity; Silicon; CMOS-MEMS; condenser microphone; corrugated; diaphragm; sensitivity;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0157-3
DOI :
10.1109/TRANSDUCERS.2011.5969162
