Localized strain sensing using high spatial resolution, highly-sensitive MEMS resonant strain gauges for failure prevention

Author

Chan, Matthew W. ; Myers, David R. ; Sosnowchik, Brian D. ; Lin, Liwei ; Pisano, Albert P.

Author_Institution

Univ. of California, Berkeley, CA, USA

fYear

2011

fDate

5-9 June 2011

Firstpage

2859

Lastpage

2862

Abstract

Experimental measurements of the first-ever MEMS double ended tuning fork (DETF) resonant strain gauge, successfully bonded to steel by rapid inductive heating are presented in this paper. The localized strain-sensing results are compared with a finite element model. With a gauge length of just 200μm, the MEMS strain gauge enables higher spatial resolution and improved localized strain detection in comparison with commonly used metal-foil strain gauges, which average strain measurement over the entire metal-foil area. This sensing improvement enables the accurate detection of localized strains and may help improve crack propagation detection, and prevent catastrophic failures in structural elements.

Keywords

failure analysis; finite element analysis; microsensors; strain gauges; strain measurement; strain sensors; vibrations; DETF resonant strain gauge; crack propagation detection; double ended tuning fork resonant strain gauge; failure prevention; finite element model; high spatial resolution; high-sensitive MEMS resonant strain gauges; improved localized strain detection; inductive heating; localized strain sensing; metal-foil strain gauges; size 200 mum; strain measurement; structural elements; Finite element methods; Micromechanical devices; Silicon; Steel; Strain; Strain measurement; Substrates; Localized strain; failure prevention; strain sensor;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Conference_Location

Beijing

ISSN

Pending

Print_ISBN

978-1-4577-0157-3

Type

conf

DOI

10.1109/TRANSDUCERS.2011.5969185

Filename

5969185