Title :
Dynamic cure and diffusion monitoring in thin encapsulant films
Author :
Day, David R. ; Shepard, David D.
Author_Institution :
Micromet Instrum. Inc., Cambridge, MA, USA
Abstract :
The response of a microdielectric sensor to cure in a thin epoxy film is investigated. The multifrequency loss-factor data are reduced to a single ion-viscosity response curve, representative of the change in ion mobility during the cure reaction. The dynamic dielectric data are compared to Tg as a function of time for several partially cured samples. The dielectric response is shown to be extremely sensitive to the entire cure process. A similar epoxy film is exposed to alternately wet and dry environments while the dielectric response is monitored. The diffusion coefficient of water in the cured resin is estimated through the dynamic change in permittivity using a simple Fickian model and the results are shown to be in good agreement with literature values. Changes in dielectric properties of a photoresistor during ultraviolet exposure are presented.<>
Keywords :
dielectric losses; dielectric properties of solids; encapsulation; glass transition (polymers); ionic conduction in solids; permittivity; polymers; Fickian model; cured resin; dielectric response; diffusion coefficient; diffusion monitoring; dynamic cure; dynamic dielectric data; encapsulant films; glass transition temperature; ion mobility; ion-viscosity response curve; ionic conductivity; microdielectric sensor response; multifrequency loss-factor; permittivity; photoresistor; thin epoxy film; ultraviolet exposure; water; Conductivity; Dielectric loss measurement; Dielectric losses; Dielectric materials; Dielectric measurements; Dielectric thin films; Monitoring; Permittivity; Resists; Thin film sensors;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/ECC.1988.12632
