Title :
Silicon carbide pressure sensor for high temperature and high pressure applications: Influence of substrate material on performance
Author :
Jin, Sheng ; Rajgopal, Srihari ; Mehregany, Mehran
Author_Institution :
Mater. Sci. & Eng., Case Western Reserve Univ., Cleveland, OH, USA
Abstract :
We have studied the effect of substrate material related to thermal mismatch for silicon carbide (SiC) diaphragm-based capacitive pressure sensors. Two sets of devices, with identical dimensions and fabrication processes were made on poly-SiC and Si substrates. Designed for a maximum pressure of 4.83 MPa (700 psi), these devices were operated in small-deflection mode and tested at room temperature and 500°C. At room temperature, the SiC- and Si-substrate devices showed sensitivities of 6.5E-04 and 6.1E-04 fF/Pa, nonlinearities of 5.0% and 3.9%, and resolutions of 0.2% and 0.3%, respectively. At 500°C, the SiC- and Si-substrate devices showed sensitivities of 1.2E-02 and 1.1E-02 fF/Pa, nonlinearities of 2.6% and 3.8%, and resolutions of 0.5% and 1.8%, respectively. For the chosen design parameters, the results show little influence of substrate material on sensor performance.
Keywords :
capacitive sensors; diaphragms; pressure sensors; silicon compounds; wide band gap semiconductors; Si; SiC; diaphragm-based capacitive pressure sensor; high pressure application; high temperature application; pressure 4.83 MPa; small-deflection mode operation; substrate material influence; temperature 293 K to 298 K; temperature 500 degC; thermal mismatch; Capacitance; Silicon; Silicon carbide; Stress; Substrates; Temperature sensors; Thermal stresses; SiC; Silicon carbide; capacitive; high temperature; pressure sensor; thermal mismatch;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0157-3
DOI :
10.1109/TRANSDUCERS.2011.5969209