DocumentCode :
2530557
Title :
Performance analysis of grinding process via particle swarm optimization
Author :
Ting, T.O. ; Lee, T.S. ; HTay, Than
Author_Institution :
Fac. of Eng., Multimedia Univ., Malacca, Malaysia
fYear :
2005
fDate :
16-18 Aug. 2005
Firstpage :
92
Lastpage :
97
Abstract :
Optimization is necessary for the control of any process to achieve better product quality, high productivity with low cost. The grinding of silicon carbide is not an easy task due to its low fracture toughness, making the material sensitive to cracking. The efficient grinding involves the optimal selection of operating parameters to maximize the material removal rate (MRR) while maintaining the required surface finish and limiting surface damage. In this work, optimization based on the available model has been carried out to obtain optimum parameters for silicon carbide grinding via particle swarm optimization (PSO) based on the objective of maximizing MRR with reference to surface finish and damage. Results obtained are superior in comparison with genetic algorithm (GA) approach.
Keywords :
genetic algorithms; grinding; machining; particle swarm optimisation; process control; silicon compounds; surface finishing; genetic algorithm; grinding process; material removal rate; particle swarm optimization; process control; silicon carbide grinding; surface damage limitation; surface finish; Bonding; Ceramics; Genetic algorithms; Machining; Particle swarm optimization; Performance analysis; Silicon carbide; Surface cracks; Surface finishing; Surface resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computational Intelligence and Multimedia Applications, 2005. Sixth International Conference on
Print_ISBN :
0-7695-2358-7
Type :
conf
DOI :
10.1109/ICCIMA.2005.45
Filename :
1540709
Link To Document :
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