• DocumentCode
    2531145
  • Title

    Temperature dependence of TDDB characteristics of thin SiO2 film for flash memory

  • Author

    Katsumata, M. ; Teramoto, A. ; Kobayashi, K. ; Mazumder, M.K. ; Sekine, M. ; Koyama, H.

  • Author_Institution
    ULSI Lab., Mitsubishi Electr. Corp., Itami, Japan
  • fYear
    1997
  • fDate
    21-25 Jul 1997
  • Firstpage
    152
  • Lastpage
    155
  • Abstract
    Using a large area capacitor, the temperature dependence of TDDB characteristics for various electric fields was investigated in detail. From the experimental results, it is found that the Qbd value is more dependent on temperature rather than on the electric field. It is also found that the initial breakdown region is divided into two parts, above 175°C, the activation energy of the front part-of the initial breakdown region is greater than the intrinsic region. It should be possible to use this newly obtained result efficiently to estimate the extrinsic breakdown distribution within a short period during the burn-in test. Therefore, the findings should contribute to the improvement of the reliability of the actual device
  • Keywords
    EPROM; MOS capacitors; dielectric thin films; electric breakdown; electric fields; integrated circuit reliability; silicon compounds; 175 C; SiO2; TDDB characteristics; activation energy; burn-in test; electric fields; extrinsic breakdown distribution estimation; flash memory; gate oxide film reliability improvement; initial breakdown region; large area capacitor; temperature dependence; thin SiO2 film; Design for quality; Electric breakdown; Flash memory; MOS capacitors; Silicon; Stress; Temperature dependence; Temperature measurement; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
  • Print_ISBN
    0-7803-3985-1
  • Type

    conf

  • DOI
    10.1109/IPFA.1997.638184
  • Filename
    638184