Title :
Deposition of reactive and non-reactive metals on titanium dioxide - Chromium and cobalt
Author :
Müller, Sebastian ; Schmeisser, D.
Author_Institution :
Angewandte Phys.-Sensorik, Brandenburgische Tech. Univ. Cottbus, Cottbus, Germany
Abstract :
The deposition of chromium and cobalt on TiO2 substrates is analyzed in a comparative study using synchrotron based photoelectron spectroscopy methods. Upon deposition of chromium the electronic structure of the TiO2 substrate is modified. The substrate is reduced while the deposited Cr becomes oxidized. Two states are observed to appear within the electronic gap and their distinct character of either Cr 3d or Ti 3d is revealed by Resonant Photoelectron Spectroscopy (ResPES). When a Cr thickness of 1.3 ML is reached, metallic Titanium is observed as well as metallic chromium. The properties of cobalt deposited on TiO2 differ from that behaviour. The reaction is only observed during the very first steps of the Co growth. Only some of the deposited Co is oxidized to Co2+ while metallic Co is the dominating component. From thermodynamic considerations a 2-dimensional growth mode for the reactive metal (chromium) is concluded while in contrast to this, cobalt is considered to have a 3-dimensional cluster growth mode corresponding to its character as non-reactive metal.
Keywords :
chromium; coating techniques; cobalt; electronic structure; photoelectron spectra; semiconductor materials; semiconductor-metal boundaries; thermodynamics; titanium compounds; 3-D cluster growth; Co-TiO2; Cr-TiO2; TiO2; chromium deposition; cobalt deposition; electronic gap; electronic structure; resonant photoelectron spectroscopy; synchrotron based photoelectron spectroscopy; thermodynamics; titanium dioxide substrates; Annealing; Chromium; Cobalt; Crystals; Gold; Inorganic materials; Spectroscopy; Surface contamination; Synchrotrons; Titanium;
Conference_Titel :
Photonics and Microsystems, 2008 International Students and Young Scientists Workshop -
Conference_Location :
Wroclaw
Print_ISBN :
978-1-4244-4971-2
Electronic_ISBN :
978-1-4244-2555-6
DOI :
10.1109/STYSW.2008.5164143