Title :
DSP architecture for cochlear implants
Author :
Marsman, Eric D. ; Senger, Robert M. ; Carichner, Gordon A. ; Kubba, Sundus ; McCorquodale, Michael S. ; Brown, Richard B.
Author_Institution :
Michigan Univ., Ann Arbor, MI
Abstract :
This paper describes low-power DSP architecture for use in cochlear implants. The microsystem, fabricated in TSMC 0.18mum CMOS, consumes 1.79mW from a 1.2V supply and occupies an area of 9.18mm2 while providing the necessary programmability for high speech comprehension by patients. Standby power consumption is 330muW
Keywords :
CMOS integrated circuits; digital signal processing chips; ear; low-power electronics; prosthetics; 0.18 micron; 1.2 V; 1.79 mW; 330 muW; CMOS DSP; cochlear implants; low-power DSP architecture; Band pass filters; Cochlear implants; Computational Intelligence Society; Digital signal processing; Ear; Electrodes; Energy consumption; Hair; Signal processing; Signal processing algorithms;
Conference_Titel :
Circuits and Systems, 2006. ISCAS 2006. Proceedings. 2006 IEEE International Symposium on
Conference_Location :
Island of Kos
Print_ISBN :
0-7803-9389-9
DOI :
10.1109/ISCAS.2006.1692671
