DocumentCode
2532222
Title
Integration of silicon circuit components onto plastic substrates using fluidic self-assembly
Author
Stauth, Sean A. ; Parviz, Babak A.
Author_Institution
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
fYear
2005
fDate
24-27 July 2005
Firstpage
147
Lastpage
152
Abstract
We demonstrate the use of fluidic self-assembly for the integration of microfabricated silicon components, including diffusion resistors and single crystal silicon field effect transistors, onto a clear, flexible plastic substrate. Preferential self-assembly of parts on a template is achieved with complementary shape recognition. The self-assembly process is driven in part by capillary forces resultant from a low melting point alloy re-flow. Our method allows for the integration of parts made via incompatible microfabrication processes onto a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connection between substrate and silicon component.
Keywords
elemental semiconductors; field effect transistors; integrated circuits; self-assembly; silicon; Si; capillary forces; crystal silicon; diffusion resistors; electrical connection; field effect transistors; fluidic self-assembly process; mechanical connection; melting point; microfabrication processes; plastic substrates; silicon integration circuit components; Circuits; Micromechanical devices; Plastics; Self-assembly; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
MEMS, NANO and Smart Systems, 2005. Proceedings. 2005 International Conference on
Print_ISBN
0-7695-2398-6
Type
conf
DOI
10.1109/ICMENS.2005.63
Filename
1540801
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