• DocumentCode
    2532222
  • Title

    Integration of silicon circuit components onto plastic substrates using fluidic self-assembly

  • Author

    Stauth, Sean A. ; Parviz, Babak A.

  • Author_Institution
    Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
  • fYear
    2005
  • fDate
    24-27 July 2005
  • Firstpage
    147
  • Lastpage
    152
  • Abstract
    We demonstrate the use of fluidic self-assembly for the integration of microfabricated silicon components, including diffusion resistors and single crystal silicon field effect transistors, onto a clear, flexible plastic substrate. Preferential self-assembly of parts on a template is achieved with complementary shape recognition. The self-assembly process is driven in part by capillary forces resultant from a low melting point alloy re-flow. Our method allows for the integration of parts made via incompatible microfabrication processes onto a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connection between substrate and silicon component.
  • Keywords
    elemental semiconductors; field effect transistors; integrated circuits; self-assembly; silicon; Si; capillary forces; crystal silicon; diffusion resistors; electrical connection; field effect transistors; fluidic self-assembly process; mechanical connection; melting point; microfabrication processes; plastic substrates; silicon integration circuit components; Circuits; Micromechanical devices; Plastics; Self-assembly; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    MEMS, NANO and Smart Systems, 2005. Proceedings. 2005 International Conference on
  • Print_ISBN
    0-7695-2398-6
  • Type

    conf

  • DOI
    10.1109/ICMENS.2005.63
  • Filename
    1540801