Title :
High reliability silver paste for die bonding
Author :
Okabe, Yukihiro ; Kusuhara, Akinobu ; Mizuno, Masuo ; Horiuchi, Koichi
Author_Institution :
Sumitomo Bakelite Co. Ltd., Kanagawa, Japan
Abstract :
A silver paste for high-reliability die bonding has been developed that meets the requirements of low-stress characteristics, for large chips/copper frames, and of high-moisture resistance, for packages using fine aluminium wiring. The low-stress material was obtained by reducing the elastic modulus of the cured material and by curing at the lowest possible temperature. Low elastic modulus was attained by using the low-molecular phenol-novolac epoxy resin and by decreasing the amount of silver powder used as a filler. The use of the phenol derivative as a curing agent resulted product with a 120 degrees C curing temperature, allowing the chip warping to be reduced to 1/4 of that of the conventional silver paste. The adoption of high-purity epoxy resin also enabled the concentration of chlorine ion to be decreased which lead to the reliability of the same degree as that of the Au-Si eutectic alloy.<>
Keywords :
integrated circuit technology; microassembling; packaging; silver; 120 C; Ag paste; Ag powder; Au-Si eutectic alloy; Cl ion concentration; Cu frames; chip warping; cured material; curing temperature; elastic modulus; fine Al wiring; high-reliability die bonding; integrated circuits; low-molecular phenol-novolac epoxy resin; low-stress characteristics; low-stress material; moisture resistance; packaging; Aluminum; Copper; Curing; Epoxy resins; Microassembly; Packaging; Powders; Silver; Temperature; Wiring;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/ECC.1988.12634
