Design considerations of vacuum-sealed OCXO´s for high reliability applications

Author

Clark, Roger L. ; Scalpi, A.

Author_Institution

Vectron Lab., Norwalk, CT, USA

fYear

1996

fDate

5-7 Jun 1996

Firstpage

481

Lastpage

483

Abstract

It is well known that the use of a vacuum sealed enclosure which contains the crystal and oscillator circuitry can be of significant value in enhancing the performance of OCXO´s. This paper reports on the design of a new vacuum sealed OCXO termed the EMXO having the design objectives of (1) a design which allows for the use of several different crystal enclosures, including the standard TO-8, (2) a parts count reduction of approximately 50% over previous designs and (3) a provision to utilize high reliability components such as class “S” on ceramic construction. The resulting oven thermal resistance measured approximately 180°C/W thereby yielding a steady state power dissipation of less than 1 W at -55°C

Keywords

circuit reliability; crystal oscillators; packaging; seals (stoppers); thermal resistance; -55 degC; 1 W; EMXO; TO-8; crystal enclosures; design objectives; parts count reduction; reliability; steady state power dissipation; thermal resistance; vacuum-sealed OCXO; Ceramics; Circuits; Costs; Electronic packaging thermal management; Manufacturing; Oscillators; Ovens; Power dissipation; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Frequency Control Symposium, 1996. 50th., Proceedings of the 1996 IEEE International.

Conference_Location

Honolulu, HI

Print_ISBN

0-7803-3309-8

Type

conf

DOI

10.1109/FREQ.1996.559898

Filename

559898