• DocumentCode
    2532882
  • Title

    Fracture mechanical characterization of micro- and nano-filled polymers by a combined experimental and simulative procedure

  • Author

    Wunderle, Bemhard ; Dermitzaki, Emmanouella D. ; Keller, Jürgen ; Vogel, Dietmar ; Michel, Bernd

  • Author_Institution
    Dept. Mech. Reliability & Micro Mater., Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
  • fYear
    2004
  • fDate
    16-19 Aug. 2004
  • Firstpage
    186
  • Lastpage
    188
  • Abstract
    With the development of micro- and nanotechnological products such as sensors, MEMS and NEMS and their broad application new reliability issues arises. The authors present a combined experimental and simulative approach targeted on unsolved questions of size effects within newly developed nanomaterials and highly integrated systems. The experimental approach is based on the in-situ SPM scans of the analyzed object carried out at different thermomechanical load states. With the application of digital image correlation techniques displacement fields with nanometer accuracy are derived. A simulative approach is performed by homogenization which is the modeling of a representative volume of bulk material taking into account a spatial distribution of the filler particles. The results of the homogenization are input data for standard finite element codes.
  • Keywords
    Young´s modulus; filled polymers; finite element analysis; fracture; nanoparticles; scanning probe microscopy; thermal conductivity; thermal expansion; digital image correlation techniques; filler particles; finite element codes; fracture; homogenization; in-situ SPM scans; mechanical properties; microfilled polymers; microtechnological products; nanofilled polymers; nanomaterials; nanotechnological products; size effects; spatial distribution; thermomechanical load states; Code standards; Digital images; Mechanical sensors; Micromechanical devices; Nanoelectromechanical systems; Nanomaterials; Polymers; Scanning probe microscopy; Sensor phenomena and characterization; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology, 2004. 4th IEEE Conference on
  • Print_ISBN
    0-7803-8536-5
  • Type

    conf

  • DOI
    10.1109/NANO.2004.1392291
  • Filename
    1392291