• DocumentCode
    2533066
  • Title

    Preliminary evaluation of a poly(phenylquinoxaline) as thermally resistant wire insulation

  • Author

    Wentworth, Stanley E. ; Rodzen, Thomas R. ; Yorgensen, Robert S. ; Diehl, W. Robert

  • Author_Institution
    US Army Mater. Technol. Lab., Watertown, MA, USA
  • fYear
    1988
  • fDate
    5-8 June 1988
  • Firstpage
    279
  • Lastpage
    281
  • Abstract
    As part of a program to identify applications for poly(phenylquinoxalines) (PPQs), their evaluation as thermally resistant wire coatings was undertaken. Because of their superior toughness, thermal stability and hydrolytic stability, PPQs appear to offer major advantages over state-of-the-art polyimide-based high temperature wire insulation. These factors in conjunction with a density 15% lower than that of polyimide suggested that aerospace wire insulation, which places a premium on weight reduction, might be an attractive application. Extrusion coating as a method of application was quickly ruled out because of the high glass temperature of the PPQs. Solution coating from m-cresol appeared promising and was evaluated. In this case however, the multistrand nature of aerospace wire led to problems. Air and/or solvent was retained in the interstitial volume between the wire strands, resulting in bubbles and voids in the coating after solvent bake-out. Application to single strand or magnet wire was more successful in that void-free coatings could be obtained.<>
  • Keywords
    insulated wires; organic insulating materials; polymers; aerospace wire insulation; bubbles; hydrolytic stability; m-cresol; magnet wire; poly(phenylquinoxaline); thermal stability; thermally resistant wire insulation; void-free coatings; voids; Cable insulation; Coatings; Costs; Laboratories; Materials science and technology; Polyimides; Temperature; Thermal resistance; Thermal stability; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1988., Conference Record of the 1988 IEEE International Symposium on
  • Conference_Location
    Cambridge, MA, USA
  • ISSN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1988.13923
  • Filename
    13923