DocumentCode
2533093
Title
Design and Implementation of Dual AIK Signing Scheme in Virtual TPM
Author
Sun, Yuqiong ; Song, Cheng ; Li, Mengqian
Author_Institution
Sch. of Comput., Beijing Univ. of Posts & Telecommun., Beijing, China
fYear
2010
fDate
18-20 Dec. 2010
Firstpage
183
Lastpage
187
Abstract
In current Xen environment, platform attests its integrity to remote customer through signing the measurements of itself by Attestation Identity Key (AIK) from virtual TPM instance. They believe that this evidence of the platform is credible since the signature of AIK can not be faked. However, this approach ignores the privileged domain and its administrator. Since they could access arbitrary memory address of the platform, they could steal the AIK and forge the measurements therefore cheats the customer. In this paper, we design and implement a dual AIK signing scheme which makes use of the AIK from hardware TPM. Through signing the measurements of platform and upper-level virtual machine separately, rogue platform could not tamper with the integrity evidence of the platform. We also present a virtual AIK certificate mechanism and a new remote integrity attestation protocol for this dual AIK signing scheme. Finally, we perform a security analysis of our approach to show that it has built a correct trust model in the trusted virtualization platform and it is truly secure.
Keywords
authorisation; cryptography; data integrity; parallel architectures; storage management; virtual machines; Xen environment; attestation identity key; dual AIK signing scheme; memory address; remote customer; remote integrity attestation protocol; rogue platform; security analysis; virtual AIK certificate mechanism; virtual TPM; virtual machine; Current measurement; Hardware; Kernel; Privacy; Protocols; Security; Virtual machining; Attestation Identity Key (AIK); Trusted Computing Base (TCB); trusted virtualization platform; vTPM;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel Architectures, Algorithms and Programming (PAAP), 2010 Third International Symposium on
Conference_Location
Dalian
Print_ISBN
978-1-4244-9482-8
Type
conf
DOI
10.1109/PAAP.2010.41
Filename
5715082
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