• DocumentCode
    2533203
  • Title

    Individually-addressable parylene microneedle arrays with integrated microchannels for retinal prosthesis study

  • Author

    Tu, H. ; Li, Y. ; Finlayson, P. ; Iezzi, R. ; Xu, Y.

  • Author_Institution
    Wayne State Univ., Detroit, MI, USA
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    1224
  • Lastpage
    1227
  • Abstract
    Retinal prostheses promise to provide artificial vision to the blind. Retinal implant based on electrical stimulation has limitations such as electrode corrosion, water hydrolysis, and generation of toxic radicals due to the large stimulation current. The more naturalistic chemical stimulation is able to effectively address these limitations of electrical stimulation. This paper reports the development of out-of-plane parylene microneedle arrays that can be individually addressed by integrated microchannels. The individually-addressable microneedle arrays were fabricated using silicon molds formed by DRIE, isotropic silicon etching of XeF2, and the conformal coating of parylene. Both rigid and flexible devices were developed. These devices enable the delivery of chemicals with controlled temporal and spatial patterns and allow us to study neurotransmitter-based retinal prostheses.
  • Keywords
    bioMEMS; conformal coatings; etching; eye; microfabrication; needles; neurophysiology; prosthetics; silicon; vision defects; DRIE; artificial vision; chemical stimulation; conformal coating; electrical stimulation; individually-addressable parylene microneedle array fabrication; integrated microchannel; isotropic silicon etching; neurotransmitter-based retinal prostheses; retinal implant; silicon mold; spatial pattern; temporal pattern; Etching; Fabrication; Metals; Microchannel; Prosthetics; Retina; Silicon; Individually-addressable; Parylene Microneedle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969399
  • Filename
    5969399