DocumentCode :
2533665
Title :
Awafer-level, heterogeneously integrated, high flow SMA-silicon gas microvalve
Author :
Gradin, H. ; Braun, S. ; Stemme, G. ; van der Wijngaart, W.
Author_Institution :
Microsyst. Technol. Lab., KTH R. Inst. of Technol., Stockholm, Sweden
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
1781
Lastpage :
1784
Abstract :
This paper presents a novel gas microvalve design in which a flow control gate is opened by the pneumatic pressure and closed by a SMA actuator, allowing large flow control. The microvalves were fabricated using a novel wafer-level Au-Si eutectic bonding process for TiNi to silicon integration. The resulting microvalves demonstrate a record pneumatic performance per footprint area; a microvalve of only 1×3.3 mm2 footprint successfully controls 3000 sccm at a pressure drop of 130 kPa.
Keywords :
bonding processes; flow control; microactuators; microfabrication; microvalves; silicon alloys; wafer level packaging; Au-Si; SMA actuator; Si; TiNi; flow control gate; high flow SMA-silicon gas microvalve design; pneumatic pressure; shape memory alloy; wafer-level eutectic bonding process; Actuators; Bonding; Gold; Logic gates; Microvalves; Silicon; Microvalve; SMA; TiNi; eutectic bonding; heterogeneous integration; shape memory alloy; wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969424
Filename :
5969424
Link To Document :
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