Title :
A new organic hybrid circuit based on an aramid/epoxy laminate
Author :
Tsunashima, Eiichi ; Hirakawa, Tadashi ; Nishimura, Kunio ; Okuno, Atsushi
Author_Institution :
Matshshita Electron. Corp., Kyoto, Japan
Abstract :
An organic hybrid circuit (OHC) that provides a novel concept for reliable semiconductor chip-on-board technology is proposed. Methods of minimizing ionic impurities are discussed with emphasis on the selection of reinforcement and the development of a new resin system. Studies are made to clarify the influence of reinforcements and resins on the electromigration properties. Electromigration of silver electrode is scrutinized through microscopic observation and advanced microanalyses. The organic substrate introduced provides minimum migration as well as high dimensional stability and high temperature resistance.<>
Keywords :
electromigration; hybrid integrated circuits; laminates; polymers; Ag electrode; OHC; advanced microanalyses; aramid/epoxy laminate; dimensional stability; electromigration properties; ionic impurities; microscopic observation; organic hybrid circuit; organic substrate; resin system; semiconductor chip-on-board technology; temperature resistance; Circuits; Electrodes; Electromigration; Laminates; Microscopy; Resins; Semiconductor device reliability; Semiconductor impurities; Silver; Substrates;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/ECC.1988.12636
