• DocumentCode
    2534472
  • Title

    Very high temperature (800°C) ohmic contact of Au/Ni2Si on n-type polycrystalline silicon carbide aged in air

  • Author

    Larger, R. ; Frechette, L.G.

  • Author_Institution
    Dept. of Mech. Eng., Univ. de Sherbrooke, Sherbrooke, QC, Canada
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    2879
  • Lastpage
    2882
  • Abstract
    Ohmic and low-resistance electrical contacts on silicon carbide have been demonstrated for the first time up to very high temperature (800°C) in an oxidizing environment. A specific contact resistance of about 2 × 10-4 Ω.cm2 was achieved after silicidation at 900°C. Long term aging tests in an oxygen atmosphere were performed, demonstrating ohmic behavior up to 1000 h at 550°C and over 4 h at 800°C. The aging mechanism has been explained, suggesting that polycrystalline 3C-SiC is not as stable as expected at very high temperatures, acting as a source for Si out-diffusion. Also, in-situ electrical measurements at very high temperatures in air using the transmission line method (L-TLM) have been achieved demonstrating good performance of the proposed metallization at representative operating conditions for harsh environments.
  • Keywords
    chemical analysis; contact resistance; gold; metallisation; nickel alloys; ohmic contacts; silicon compounds; temperature measurement; thermal stability; Au-Ni2Si; SiC; long term aging tests; low-resistance electrical contacts; n-type polycrystalline silicon carbide; oxygen atmosphere; specific contact resistance; temperature 550 degC; temperature 800 degC; temperature 900 degC; transmission line method; very high temperature ohmic contact; Gold; Nickel; Oxidation; Silicon; Silicon carbide; Temperature measurement; Thyristors; SiC; formation mechanism; ohmic contact; oxidation; silicon diffusion; transition metal silicides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969471
  • Filename
    5969471