DocumentCode :
2534670
Title :
Creep of parylene-C film
Author :
Lin, Jeffrey Chun-Hui ; Deng, Peigang ; Lam, Gilbert ; Lu, Bo ; Lee, Yi-Kuen ; Tai, Yu-Chong
Author_Institution :
California Inst. of Technol., Pasadena, CA, USA
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
2698
Lastpage :
2701
Abstract :
The glass transition temperature of as-deposited parylene-C is first measured to be 50°C with a ramping-temperature-dependent modulus experiment. The creep behavior of parylene-C film in the primary and secondary creep region is then investigated below and above this glass transition temperature using a dynamic mechanical analysis (DMA) machine Q800 from TA instruments at 8 different temperatures: 10, 25, 40, 60, 80, 100, 120 and 150°C. The Burger´s model, which is the combined Maxwell model and Kelvin-Voigt model, fits well with our primary and secondary creep data. Accordingly, the results show that there´s little or no creep below the glass transition temperature. Above the glass transition temperature, the primary creep and creep rate increases with the temperature, with a retardation time constant around 6 minutes.
Keywords :
creep fracture; glass transition; viscoelasticity; Kelvin-Voigt model; Maxwell model; as-deposited parylene-C; creep behavior; dynamic mechanical analysis machine; glass transition temperature; ramping-temperature-dependent modulus experiment; temperature 10 degC; temperature 100 degC; temperature 120 degC; temperature 150 degC; temperature 25 degC; temperature 40 degC; temperature 50 degC; temperature 60 degC; temperature 80 degC; Creep; Glass; Mathematical model; Plastics; Strain; Stress; Temperature measurement; Creep; glass transition temperature; parylene-C; viscoelasticity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969483
Filename :
5969483
Link To Document :
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