• DocumentCode
    2534685
  • Title

    Adhesion-enhancing surface treatments for parylene deposition

  • Author

    Chang, Jay Han-Chieh ; Lu, Bo ; Tai, Yu-Chong

  • Author_Institution
    California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    390
  • Lastpage
    393
  • Abstract
    Parylene-C has been extensively used in biomedical devices as a conformal and biocompatible coating. It is also a good material for implantation. Unfortunately, serious delamination between parylene-C and other materials is often found even during standard MEMS processes such as lift-off and sacrificial photoresist releasing. Therefore, surface treatments before parylene deposition that can enhance the interface adhesion between the deposited parylene and the coated surface are highly desirable. Interestingly, the chemical structure of Parylene-C does suggest that parylene-C deposition on a clean hydrophobic surface favors a good interface adhesion. This work is then to study various surface treatments, especially on silicon and another parylene-C surfaces, by hexane, toluene, propylene carbonate (P.C.), and tetrafluoromethane (CF4) plasma. Our hypothesis is then good surface cleaning can lead to interface adhesion. We report the results here using parameters such as peeling force, soaking undercut rate, and vertical attack bubble density (VABD) to quantify the effectiveness of these adhesion treatments.
  • Keywords
    adhesion; cleaning; coating techniques; delamination; elemental semiconductors; polymers; silicon; surface treatment; MEMS processes; VABD; adhesion-enhancing surface treatments; biocompatible coating; biomedical devices; force peeling; hydrophobic surface; lift-off photoresist releasing; parylene-C deposition; parylene-C surfaces; propylene carbonate; sacrificial photoresist releasing; tetrafluoromethane plasma; undercut rate soaking; vertical attack bubble density; Adhesives; Films; Force; Hafnium; Silicon; Surface cleaning; Adhesion; Parylene-C; Peeling Test;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969484
  • Filename
    5969484