DocumentCode
2534685
Title
Adhesion-enhancing surface treatments for parylene deposition
Author
Chang, Jay Han-Chieh ; Lu, Bo ; Tai, Yu-Chong
Author_Institution
California Inst. of Technol., Pasadena, CA, USA
fYear
2011
fDate
5-9 June 2011
Firstpage
390
Lastpage
393
Abstract
Parylene-C has been extensively used in biomedical devices as a conformal and biocompatible coating. It is also a good material for implantation. Unfortunately, serious delamination between parylene-C and other materials is often found even during standard MEMS processes such as lift-off and sacrificial photoresist releasing. Therefore, surface treatments before parylene deposition that can enhance the interface adhesion between the deposited parylene and the coated surface are highly desirable. Interestingly, the chemical structure of Parylene-C does suggest that parylene-C deposition on a clean hydrophobic surface favors a good interface adhesion. This work is then to study various surface treatments, especially on silicon and another parylene-C surfaces, by hexane, toluene, propylene carbonate (P.C.), and tetrafluoromethane (CF4) plasma. Our hypothesis is then good surface cleaning can lead to interface adhesion. We report the results here using parameters such as peeling force, soaking undercut rate, and vertical attack bubble density (VABD) to quantify the effectiveness of these adhesion treatments.
Keywords
adhesion; cleaning; coating techniques; delamination; elemental semiconductors; polymers; silicon; surface treatment; MEMS processes; VABD; adhesion-enhancing surface treatments; biocompatible coating; biomedical devices; force peeling; hydrophobic surface; lift-off photoresist releasing; parylene-C deposition; parylene-C surfaces; propylene carbonate; sacrificial photoresist releasing; tetrafluoromethane plasma; undercut rate soaking; vertical attack bubble density; Adhesives; Films; Force; Hafnium; Silicon; Surface cleaning; Adhesion; Parylene-C; Peeling Test;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location
Beijing
ISSN
Pending
Print_ISBN
978-1-4577-0157-3
Type
conf
DOI
10.1109/TRANSDUCERS.2011.5969484
Filename
5969484
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