• DocumentCode
    2534724
  • Title

    Low-cost fabrication of PMMA and PMMA based magnetic composite cantilevers

  • Author

    Suter, M. ; Li, Y. ; Sotiriou, G.A. ; Teleki, A. ; Pratsinis, S.E. ; Hierold, C.

  • Author_Institution
    Dept. of Mech. & Process Eng., ETH Zurich, Zurich, Switzerland
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    398
  • Lastpage
    401
  • Abstract
    We present a simple and low-cost fabrication process for microcantilevers from both pure Polymethylmethacrylate (PMMA) and magnetic PMMA composites with maghemite nanoparticle concentrations up to 3 vol.% (12 wt.%). The fabricated cantilevers have lengths of 30 - 300 μm, widths of 14 μm and a thickness of 3 μm. The presented fabrication process consists of structural layer patterning by hot embossing, removal of the residual layer by a deep ultraviolet (DUV) exposure step through a partially transparent mold and a sacrificial layer etch to release the suspended microstructures. Process parameters including hot embossing temperature and pressure have been studied. The optimized parameters for pure PMMA are 180° C and 2370 N/cm2 and for magnetic composite with 3 vol.% nanoparticle concentration 195°C and 2660 N/cm2. The molded cantilevers show a well transferred pattern and a sharp side wall profile.
  • Keywords
    cantilevers; microfabrication; nanoparticles; DUV; PMMA; deep ultraviolet; hot embossing; low-cost fabrication process; maghemite nanoparticle concentration; magnetic composite cantilever; microcantilevers; microstructures; size 14 mum; size 30 mum to 300 mum; temperature 195 degC; Embossing; Fabrication; Magnetic resonance imaging; Microstructure; Nanoparticles; Polymers; Silicon compounds; PMMA cantilevers; magnetic PMMA composite cantilevers; silica coated superparamagnetic maghemite nanoparticles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969487
  • Filename
    5969487