Parallel optical interconnect-a cost performance breakthrough

Author

Crow, John

Author_Institution

IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

Volume

2

fYear

1996

fDate

18-21 Nov. 1996

Firstpage

3

Abstract

Recently, parallel optical interconnect (POI) prototypes and products have been designed to meet short distance (<200 meters) computer system and telecommunications switch system applications with low cost as a paramount objective. Optoelectronic chips and optical components were chosen for ease in packaging. This paper will describe the chips, packaging, cabling, design and testing tools, and system level testbeds developed for two of these projects: Jitney and OETC.

Keywords

integrated circuit design; integrated circuit packaging; integrated circuit testing; integrated optoelectronics; laser cavity resonators; optical computing; optical interconnections; parallel architectures; semiconductor laser arrays; surface emitting lasers; 200 m; cost performance breakthrough; optical components; optical interconnections; optoelectronic chips; packaging; short distance computer system; system level testbeds; telecommunications switch system; testing tools; Concurrent computing; Costs; Optical computing; Optical design; Optical interconnections; Packaging; Product design; Prototypes; System testing; Telecommunication computing;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-3160-5

Type

conf

DOI

10.1109/LEOS.1996.571518

Filename

571518