Room-temperature reactive bonding by using nano scale multilayer systems

This paper focuses on room-temperature reactive bonding by using nano scale multilayer systems. The exothermic reaction within the Ti/a-Si multilayer is used as an internal heat source for bonding. Herein, we used lithographical, wet etching and electro-plating procedures to generate very thin integrated reactive multilayer systems. The reaction in the very thin films generated enough heat to self-propagate and to melt tin films. High-speed camera imaging was used to characterize the reaction kinetics and the propagation of the reaction front onto substrates. Furthermore, we demonstrated a strong dependence on substrate material for adhesion after the reaction front has passed.