DocumentCode
2534989
Title
Future technology options for optical interconnections
Author
Cheng, Julian
Author_Institution
Center for High Technol. Mater., New Mexico Univ., Albuquerque, NM, USA
Volume
2
fYear
1996
fDate
18-21 Nov. 1996
Abstract
The enabling technology that provided the new impetus for parallel optical data links is the vertical-cavity surface-emitting laser (VCSEL), which possesses much higher optical power, speed, and efficiency, while producing much lower power dissipation. VCSEL arrays have been used in parallel optical data links such as OETC, POLO, and OPTOBUS to provide highspeed data communication between computer processors. VCSEL-based optical networks may play a role at many different levels of the interconnection hierarchy, including but not limited to multiprocessor networks, boards in a backplane, and multi-chip modules. The VCSEL´s potential lies beyond its initial technology insertion in simple point-to-point optical links.
Keywords
laser cavity resonators; multiprocessor interconnection networks; optical interconnections; parallel architectures; semiconductor lasers; surface emitting lasers; OPTOBUS; VCSEL; VCSEL-based optical networks; computer processor; enabling technology; highspeed data communication; interconnection hierarchy; lower power dissipation; multiprocessor networks; optical interconnections; optical power; parallel optical data links; point-to-point optical links; speed; vertical-cavity surface-emitting laser; Concurrent computing; Data communication; Optical arrays; Optical computing; Optical fiber networks; Optical interconnections; Power dissipation; Power lasers; Surface emitting lasers; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-3160-5
Type
conf
DOI
10.1109/LEOS.1996.571519
Filename
571519
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