Plasma enhanced bonding of polydimethylsiloxane (PDMS) with parylene

Author

Rezai, P. ; Selvaganapathy, P.R. ; Wohl, G.R.

Author_Institution

Dept. of Mech. Eng., McMaster Univ., Hamilton, ON, Canada

fYear

2011

fDate

5-9 June 2011

Firstpage

1340

Lastpage

1343

Abstract

PDMS and parylene are among the most widely used polymers in biomedical and microfluidic applications. However, integration of both these materials on a single device has not been possible due to low bond strength achieved using conventional methods. In this paper, we demonstrate plasma-enhanced bonding of PDMS slabs with parylene thin films (from 0.4MPa for PDMS glued assembly to >;1.4MPa tensile strength enhancement) without the usage of high temperature or pressure. This was achieved by systematic investigation of bonding parameters using Taguchi´s design of experiment method. The application of this bond has also been demonstrated in PDMS-parylene microfluidic channels.

Keywords

Taguchi methods; bonding processes; microassembling; microchannel flow; plasma chemistry; polymer films; polymerisation; thin films; PDMS; Taguchi´s design; biomedical; glued assembly; microfluidic channels; parylene thin films; plasma enhanced bonding; polydimethylsiloxane; polymers; Bonding; Materials; Microchannel; Microfluidics; Partial discharges; Plasmas; Sulfur hexafluoride; Bond; PDMS; Parylene; Plasma bonding; Polydimethylsiloxane; Polymer bonding; SF6;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Conference_Location

Beijing

ISSN

Pending

Print_ISBN

978-1-4577-0157-3

Type

conf

DOI

10.1109/TRANSDUCERS.2011.5969502

Filename

5969502