Title :
Measurement of spatial electric field distribution in polymer films by using an acoustic step-wave probing technique
Author :
Takada, Tatsuo ; Soda, Keiichi
Author_Institution :
Musashi Inst. of Technol., Tokyo, Japan
Abstract :
An acoustic step-wave probing technique was used to investigate the electric field distribution in insulating materials subjected to a high DC electric stress. The acoustic step pressure was generated by applying a high-voltage step (rise time <10 ns to 3 kV) to a piezoelectric transducer of LiNbO3. The deconvolution technique was used to process the output acoustic signal, because this signal does not represent the profile of the electric field distribution in a sample directly. The electric field distortion in the sample was observed as a function time for two different parameters: electric field intensity (104-105 V/cm), and temperature of the samples (20-85°C). The results indicate that no distortion of electric field occurred for either of the applied voltages when the sample was maintained at room temperature. On the other hand, when the sample temperature was increased to greater than about 55°C, distortion of the electric fields was clearly observed
Keywords :
electric field measurement; lithium compounds; organic insulating materials; piezoelectric transducers; polymer films; 10 ns; 20 to 85 C; 3 kV; LiNbO3; acoustic step pressure; acoustic step-wave probing technique; deconvolution technique; distortion of electric field; electric field distortion; electric field intensity; high DC electric stress; high-voltage step; output acoustic signal; piezoelectric transducer; polymer films; rise time; room temperature; sample temperature; spatial electric field distribution; temperature; Acoustic distortion; Acoustic materials; Acoustic measurements; Dielectrics and electrical insulation; Electric variables measurement; Piezoelectric transducers; Polymer films; Signal processing; Stress; Temperature;
Conference_Titel :
Properties and Applications of Dielectric Materials, 1988. Proceedings., Second International Conference on Properties and Applications of
Conference_Location :
Beijing
DOI :
10.1109/ICPADM.1988.38419
